Invention Grant
- Patent Title: Polyarylene sulfide resin composition and molded body
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Application No.: US14387368Application Date: 2013-03-22
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Publication No.: US09725596B2Publication Date: 2017-08-08
- Inventor: Masanori Uchigata , Takayuki Okada , Taku Shimaya
- Applicant: DIC Corporation
- Applicant Address: JP Tokyo
- Assignee: DIC Corporation
- Current Assignee: DIC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP2012-067271 20120323
- International Application: PCT/JP2013/058308 WO 20130322
- International Announcement: WO2013/141363 WO 20130926
- Main IPC: C08L81/04
- IPC: C08L81/04 ; C08K7/14 ; C08K3/40

Abstract:
Provided is a polyarylene sulfide resin composition including a polyarylene sulfide resin, an epoxy resin, glass fiber, and glass flake. The amount of the epoxy resin is 0.5 to 20 parts by mass, the amount of the glass fiber is 10 to 350 parts by mass, and the amount of the glass flake is 1 to 250 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin. The epoxy resin is a combination of a bisphenol-type epoxy resin and a novolac-type epoxy resin. Also provided is a molded body formed by melt-molding the resin composition. The resin composition has good adhesiveness to epoxy resins and good flowability. Furthermore, a molded body having high thermal shock resistance can be produced using the resin composition.
Public/Granted literature
- US20150080498A1 POLYARYLENE SULFIDE RESIN COMPOSITION AND MOLDED BODY Public/Granted day:2015-03-19
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