Invention Grant
- Patent Title: Anisotropic conductive film, connection method, and assembly
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Application No.: US14425462Application Date: 2013-09-10
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Publication No.: US09723715B2Publication Date: 2017-08-01
- Inventor: Yasunobu Yamada , Naoya Uesawa , Kazuhisa Aoki
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Buchanan, Ingersoll & Rooney PC
- Priority: JP2012-203978 20120918
- International Application: PCT/JP2013/074317 WO 20130910
- International Announcement: WO2014/045931 WO 20140327
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/09 ; H05K1/03 ; C09J9/02 ; C08L67/00 ; C08L75/04 ; C08L13/00 ; H05K3/32 ; H05K13/04

Abstract:
An anisotropic conductive film, which contains a crystalline resin, an amorphous resin, and conductive particles, wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a first electronic part and a terminal of a second electronic part, and wherein the crystalline resin contains a crystalline resin containing a bond characterizing a resin, which is identical to a bond characterizing a resin contained in the amorphous resin.
Public/Granted literature
- US20150237725A1 ANISOTROPIC CONDUCTIVE FILM, CONNECTION METHOD, AND ASSEMBLY Public/Granted day:2015-08-20
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