Low passive intermodulation (PIM) antenna assemblies and methods for utilizing the same. In one embodiment, the low PIM antenna assemblies described herein offer the lowest PIM level for the DAS antenna as compared with current PIM solutions currently available in the market place as well as the improvement of isolation between the radiating elements using inserted isolation rings as well as a more omni-directional radiation pattern using the insertion of slots into the radiating elements themselves. Methods of manufacturing and using the aforementioned low PIM antenna assembly are also disclosed.