Invention Grant
- Patent Title: Planar antenna microwave module
-
Application No.: US14704932Application Date: 2015-05-05
-
Publication No.: US09722302B2Publication Date: 2017-08-01
- Inventor: Yabing Cheng
- Applicant: HYTRONIK ELECTRONICS CO., LTD
- Applicant Address: CN Shenzhen
- Assignee: HYTRONIK ELECTRONICS CO., LTD
- Current Assignee: HYTRONIK ELECTRONICS CO., LTD
- Current Assignee Address: CN Shenzhen
- Priority: CN201320198998U 20130419
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; G01S13/50

Abstract:
The present invention discloses a planar antenna microwave module, including an oscillation circuit board and a planar antenna board. The oscillation circuit board is a double-sided printed circuit board. The planar antenna board is a double-sided PCB independent of the oscillation circuit board. PCB copper foil of the planar antenna board forms a transmitting/receiving planar antenna. The planar antenna is laminated on a bottom surface of the oscillation circuit board by using a solder joint that runs through and electrically connects two layers of PCB copper foil, and is electrically connected to the oscillation circuit board through the solder joint. The antenna boards in the present invention are of independent and separate structures, and have a small design size, a simple manufacturing process, a short production cycle, low costs, and high economic benefits.
Public/Granted literature
- US20150236403A1 PLANAR ANTENNA MICROWAVE MODULE Public/Granted day:2015-08-20
Information query