Invention Grant
- Patent Title: Semiconductor device
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Application No.: US14960444Application Date: 2015-12-07
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Publication No.: US09722080B2Publication Date: 2017-08-01
- Inventor: En-Chiuan Liou , Yu-Cheng Tung
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN201510769647 20151112
- Main IPC: H01L29/24
- IPC: H01L29/24 ; H01L29/78 ; H01L29/16 ; H01L29/161 ; H01L29/165 ; H01L29/08 ; H01L29/66

Abstract:
The present invention provides a semiconductor device, including a substrate, two gate structures disposed on a channel region of the substrate, an epitaxial layer disposed in the substrate between two gate structures, a first dislocation disposed in the epitaxial layer, wherein the profile of the first dislocation has at least two non-parallel slanting lines, and a second dislocation disposed adjacent to a top surface of the epitaxial layer, and the profile of the second dislocation has at least two non-parallel slanting lines.
Public/Granted literature
- US20170141229A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE Public/Granted day:2017-05-18
Information query
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