Invention Grant
- Patent Title: Semiconductor device and semiconductor module
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Application No.: US14926475Application Date: 2015-10-29
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Publication No.: US09722060B2Publication Date: 2017-08-01
- Inventor: Hiroyuki Nakamura , Akira Okada , Eiji Nojiri
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2015-028540 20150217
- Main IPC: H01L29/73
- IPC: H01L29/73 ; H01L29/739 ; H01L29/423 ; H01L23/544 ; H01L21/66

Abstract:
In a semiconductor device, an element forming region formed with a semiconductor element for controlling a current is defined on a surface of a semiconductor substrate. A termination region is defined so as to surround the element forming region. In a gate electrode, a probe-contacting region and a wire region are defined. The probe-contacting region and the wire region are separated by an insulator formed on a surface of the gate electrode. Thus, the surface of the probe-contacting region and the surface of the wire region are located at the same height.
Public/Granted literature
- US20160240637A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE Public/Granted day:2016-08-18
Information query
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