Invention Grant
- Patent Title: Silicon carbide semiconductor device
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Application No.: US15111642Application Date: 2015-01-16
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Publication No.: US09722017B2Publication Date: 2017-08-01
- Inventor: Takaaki Tominaga , Naoyuki Kawabata , Nobuyuki Tomita
- Applicant: MITSUBISHI ELECTRIC CORPORATION
- Applicant Address: JP Chiyoda-ku
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-012880 20140128; JP2014-158615 20140804
- International Application: PCT/JP2015/051015 WO 20150116
- International Announcement: WO2015/115202 WO 20150806
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/161 ; H01L29/872 ; H01L29/47 ; H01L29/36 ; H01L29/861 ; H01L29/16 ; H01L29/32 ; H01L29/66 ; H01L29/04 ; H01L29/10 ; H01L29/167 ; H01L29/78

Abstract:
A silicon carbide semiconductor device capable of achieving a decrease in ON resistance and an increase in breakdown voltage and a method for manufacturing a silicon carbide semiconductor device. A silicon carbide semiconductor device includes a silicon carbide substrate and a drift layer. The drift layer includes a breakdown voltage holding layer extending from a point where a doping concentration has a predetermined value to a surface of the drift layer. The doping concentration in the breakdown voltage holding layer continuously decreases from the point where the doping concentration has the predetermined value to a modulation point located further toward the surface of the drift layer than a midpoint in a film thickness direction of the breakdown voltage holding layer. The doping concentration in the breakdown voltage holding layer continuously increases from the modulation point to the surface of the drift layer.
Public/Granted literature
- US20160336392A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND SILICON CARBIDE SEMICONDUCTOR DEVICE MANUFACTURING METHOD Public/Granted day:2016-11-17
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