Invention Grant
- Patent Title: Semiconductor device and method of manufacturing
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Application No.: US14178429Application Date: 2014-02-12
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Publication No.: US09721947B2Publication Date: 2017-08-01
- Inventor: Harry Hak-Lay Chuang , Wei Cheng Wu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L29/78 ; H01L29/161 ; H01L29/16 ; H01L21/265 ; H01L21/266 ; H01L29/66 ; H01L21/02 ; H01L29/51 ; H01L29/165

Abstract:
A semiconductor device includes a semiconductor substrate, and first and second transistors over the semiconductor substrate. Both the first and second transistors are p-type transistors or both the first and second transistors are n-type transistors. The first and second transistors have the same nominal operating voltage. The first transistor has a higher threshold voltage than the second transistor. The second transistor has at least one of a source region or a drain region with higher charge carrier mobility than at least one of a source region or a drain region of the first transistor.
Public/Granted literature
- US20150228645A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING Public/Granted day:2015-08-13
Information query
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