- Patent Title: Method for making a three dimensional integrated electronic circuit
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Application No.: US14993598Application Date: 2016-01-12
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Publication No.: US09721850B2Publication Date: 2017-08-01
- Inventor: Bernard Previtali , Maud Vinet
- Applicant: Commissariat a l'energie atomique et aux energies alternatives
- Applicant Address: FR Paris
- Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
- Current Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1550335 20150116
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L27/06 ; H01L21/8238 ; H01L27/02 ; H01L21/768 ; H01L23/485 ; H01L23/528 ; H01L23/535 ; H01L21/822
Abstract:
A method for making a three-dimensional integrated electronic circuit is provided, including making a first electrically conductive portion on a first dielectric layer covering a first semiconductor layer; then making a second dielectric layer covering the first electrically conductive portion such that it is disposed between the first and second dielectric layers, and a second semiconductor layer disposed on the second dielectric layer; then making a first electronic component in the second semiconductor layer, and a second electronic component in the first semiconductor layer; then making an electrical interconnection electrically linking the first and second electronic components together, of which a first part passes through the first dielectric layer and electrically connects the second electronic component to the first electrically conductive portion and of which a second part passes through a part of the second dielectric layer and electrically connects the first electronic component to the first electrically conductive portion.
Public/Granted literature
- US20160211184A1 METHOD FOR MAKING A THREE DIMENSIONAL INTEGRATED ELECTRONIC CIRCUIT Public/Granted day:2016-07-21
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