Invention Grant
- Patent Title: Frame panel for three-dimensional sign board
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Application No.: US15021676Application Date: 2014-05-15
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Publication No.: US09721486B2Publication Date: 2017-08-01
- Inventor: Kwang Yrul Yoon , Sang Moo Lee
- Applicant: Kwang Yrul Yoon , Sang Moo Lee
- Applicant Address: US CA San Diego
- Assignee: SEOUL LASER DIEBOARD SYSTEM CO. LTD.
- Current Assignee: SEOUL LASER DIEBOARD SYSTEM CO. LTD.
- Current Assignee Address: US CA San Diego
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Priority: KR10-2013-0108906 20130911
- International Application: PCT/KR2014/004357 WO 20140515
- International Announcement: WO2015/037810 WO 20150319
- Main IPC: G09F13/04
- IPC: G09F13/04 ; G09F13/22

Abstract:
A frame panel for a three-dimensional sign board, a three-dimensional sign board including the panel, and a manufacturing method therefor. The frame panel includes a band-shaped frame panel which is cut into a predetermined length and wound in the form of a coil so that the frame panel can be bent and shaped into a desired pattern such as a character; and hitch units on which an upper panel is fixated, which are formed along the longitudinal direction of the frame panel and which are spaced apart from each other on two ends of one side of the frame panel. The hitch units are made of a soft synthetic resin material, which is the same material as used for the upper panel.
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