Invention Grant
- Patent Title: Connector, data transmitting apparatus, data receiving apparatus, and data transmitting and receiving system
-
Application No.: US14785135Application Date: 2014-03-18
-
Publication No.: US09698539B2Publication Date: 2017-07-04
- Inventor: Kazuaki Toba , Akira Matsuda , Taichi Hirano
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Paratus Law Group, PLLC
- Priority: JP2013-093891 20130426
- International Application: PCT/JP2014/057415 WO 20140318
- International Announcement: WO2014/174941 WO 20141030
- Main IPC: H01R13/6587
- IPC: H01R13/6587 ; H01R13/6581 ; H01R24/66 ; H01R13/6594 ; H05K5/02 ; H01R24/60

Abstract:
To be able to further reduce deterioration in signal quality, there is provided a connector including: a signal pin (11) that is connected to a wiring pattern (15) on a mounted substrate (14) and that transmits a signal to an inside and an outside of any apparatus, the mounted substrate (14) having an end disposed in the apparatus; and a shell (13) that is formed of an electric conductor and grounded to ground potential on the mounted substrate (14), in a manner that the shell (13) covers the signal pin (11) in a region in which the signal pin (11) stretches toward the mounted substrate (14).
Public/Granted literature
Information query
IPC分类: