A substrate-based circuit (31) provides a carrier substrate (2), wherein a bond layer (5) is embodied on at least one part of the carrier substrate (2), and wherein a contact layer (6) which forms at least one conductor line (7) and/or at least one antenna element (8) is embodied on at least one first part (51) of the bond layer (5). The carrier substrate (2) provides at least one fastening element (20), which is deposited at the outer region of the carrier substrate (2) and projects beyond the outer region of the carrier substrate (2).