Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15036987Application Date: 2014-09-30
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Publication No.: US09698220B2Publication Date: 2017-07-04
- Inventor: Noriyuki Hirakata
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; F. Brock Riggs
- Priority: JP2013-238960 20131119
- International Application: PCT/JP2014/076031 WO 20140930
- International Announcement: WO2015/076020 WO 20150528
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L31/0312 ; H01L29/06 ; H01L29/739 ; H01L29/16 ; H01L21/04 ; H01L29/417 ; H01L29/66 ; H01L29/78 ; H01L29/04 ; H01L29/10 ; H01L29/45

Abstract:
A MOSFET includes: a SiC layer including one main surface and provided with a plurality of contact regions; and a plurality of source electrodes formed in contact with the contact regions. In the MOSFET, in a plan view of the one main surface, a plurality of cells including the contact regions and the source electrodes are formed adjacent to one another, each of the plurality of cells having an outer circumferential shape that is a shape of hexagon including a long axis. According to the MOSFET, a contact resistance between each contact region and each source electrode can be further reduced, thereby attaining a more improved electrical property.
Public/Granted literature
- US20160308003A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-10-20
Information query
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