Invention Grant
- Patent Title: Method of manufacturing element chip and method of manufacturing electronic component-mounted structure using plasma etch to singulate element chip
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Application No.: US15267059Application Date: 2016-09-15
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Publication No.: US09698052B2Publication Date: 2017-07-04
- Inventor: Atsushi Harikai , Shogo Okita , Noriyuki Matsubara
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon, LLP
- Priority: JP2015-195520 20151001
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/02 ; H01L21/3065 ; H01L21/48 ; H01L21/683 ; H01L23/29 ; H01L23/00 ; H01L21/60
Abstract:
In a method of manufacturing an element chip for manufacturing a plurality of element chips by dividing a substrate, where the protruding portions, which are exposed element electrodes, are formed on element regions, protection films made of fluorocarbon film are formed on a second surface and side surfaces of the element chip, and a first surface in a gap by exposing the element chip to second plasma after the substrate is divided by etching. Next, the protection films formed on the second surface and the side surfaces of the element chip are removed while leaving at least a part of the protection film formed in the gap by exposing the element chip to third plasma. Therefore, creep-up of a conductive material in a mounting step is suppressed by the left protection film.
Public/Granted literature
- US20170098590A1 METHOD OF MANUFACTURING ELEMENT CHIP AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT-MOUNTED STRUCTURE Public/Granted day:2017-04-06
Information query
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