Invention Grant
- Patent Title: Semiconductor device and semiconductor module
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Application No.: US14537234Application Date: 2014-11-10
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Publication No.: US09697948B2Publication Date: 2017-07-04
- Inventor: Kosei Osada , Isamu Nishimura , Tetsuya Kagawa , Daiki Yanagishima , Toshiyuki Ishikawa , Michihiko Mifuji , Satoshi Kageyama , Nobuyuki Kasahara
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2013-235190 20131113; JP2013-235191 20131113; JP2014-145041 20140715; JP2014-219492 20141028
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01F27/28 ; H01L23/64 ; H01L23/58 ; H01L23/495 ; H01L23/31
Abstract:
The semiconductor device of the present invention includes an insulating layer, a high voltage coil and a low voltage coil which are disposed in the insulating layer at an interval in the vertical direction, a low potential portion which is provided in a low voltage region disposed around a high voltage region for the high voltage coil in planar view and is connected with potential lower than the high voltage coil, and an electric field shield portion which is disposed between the high voltage coil and the low voltage region and includes an electrically floated metal member.
Public/Granted literature
- US20150137314A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE Public/Granted day:2015-05-21
Information query
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