An electronic component is provided which includes a helical coil having good coil characteristics and high reliability without peeling or breakage in each insulator layer. As compared to an existing configuration in which coil patterns are disposed on insulator layers 2a to 2d, respectively, so as to fully overlap each other in a plan view, portions where coil patterns 11 to 14 intersect each other in a plan view are dispersed and the number of the coil patterns 11 to 14 overlapping each other in each intersection portion is small. Thus, a change in thickness of a multilayer body in which the respective insulator layers 2a to 2d are stacked is suppressed. Therefore, the pressure applied when the respective insulator layers 2a to 2d are pressure-bonded is uniformly transmitted to the entire multilayer body, and thus it is possible to provide an electronic component having good coplanarity and high reliability.