Invention Grant
- Patent Title: Slurry composition for chemical mechanical polishing of metal and polishing method using the same
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Application No.: US11965453Application Date: 2007-12-27
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Publication No.: US09695347B2Publication Date: 2017-07-04
- Inventor: Homer Chou , Won Lae Kim , Jong Il Noh , In Kyung Lee , Tae Young Lee
- Applicant: Homer Chou , Won Lae Kim , Jong Il Noh , In Kyung Lee , Tae Young Lee
- Applicant Address: KR Yongin-si
- Assignee: Samsung SDI Co., Ltd.
- Current Assignee: Samsung SDI Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Additon, Higgins & Pendleton, P.A.
- Priority: KR10-2007-0102316 20071010
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; C09K3/14 ; C09G1/02 ; C23F3/06 ; H01L21/321
Abstract:
Provided is a slurry composition for chemical mechanical polishing (CMP) of a metal. The slurry composition comprises a copolymer whose average molecular weight is from about 600,000 to about 1,300,000 and whose monomers are acrylic acid and acrylamide in a molar ratio of about 1:30 to about 30:1. The slurry composition exhibits a non-Prestonian behavior to achieve minimized dishing and attain a high degree of planarization.
Public/Granted literature
- US20090095939A1 Slurry Composition for Chemical Mechanical Polishing of Metal and Polishing Method Using the Same Public/Granted day:2009-04-16
Information query
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