Invention Grant
- Patent Title: Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
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Application No.: US14140607Application Date: 2013-12-26
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Publication No.: US09695294B2Publication Date: 2017-07-04
- Inventor: Min Gyum Kim , Seung Han , Hwan Sung Cheon
- Applicant: Min Gyum Kim , Seung Han , Hwan Sung Cheon
- Applicant Address: KR Gumi-Si, Kyeongsangbuk-do
- Assignee: Cheil Industries, Inc.
- Current Assignee: Cheil Industries, Inc.
- Current Assignee Address: KR Gumi-Si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2012-0153915 20121226
- Main IPC: C08G59/04
- IPC: C08G59/04 ; C08G59/62 ; C08L63/00 ; C07F9/28 ; C07F9/54 ; C07F9/6571 ; C08K3/36 ; C08K3/00 ; H01L23/29

Abstract:
An epoxy resin composition includes: an epoxy resin; a curing agent; a curing accelerator; and an inorganic filler, wherein the curing accelerator includes a 4-valent ammonium salt or a 4-valent phosphonium salt represented by Formula 1, wherein A1 is nitrogen or phosphorus; R1, R2, R3 and R4 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom; X1, X2, X3, X4, X5 and X6 are each independently an oxygen atom (O), a sulfur atom (S), or NH; and Y1, Y2 and Y3 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom.
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