Invention Grant
- Patent Title: Heat-receiving device, cooling device, and electronic device
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Application No.: US14611577Application Date: 2015-02-02
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Publication No.: US09681591B2Publication Date: 2017-06-13
- Inventor: Jun Taguchi
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki-Shi
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Staas & Halsey LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/473 ; F28F27/02

Abstract:
A heat-receiving device includes: a first heat receiver into which a refrigerant flows, and that receives heat from a heat-generating part; and a second heat receiver into which the refrigerant discharged from the first heat receiver flows, and that receives heat from the heat-generating part or another heat-generating part; wherein the first heat receiver includes: a case; a flow path that includes first and second branch paths branch off from each other and are joined again, that is provided within the case, and through which the refrigerant flows; and a thermostat that is provided in the first branch path, and that reduces a flow rate of the refrigerant flowing through the first branch path as a temperature of the refrigerant flowing through the first branch path decreases.
Public/Granted literature
- US20150146376A1 HEAT-RECEIVING DEVICE, COOLING DEVICE, AND ELECTRONIC DEVICE Public/Granted day:2015-05-28
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