Disclosed herein are a variety of embodiments of thick film circuits with conductive components formed using different conductive elements and related methods for forming such circuits. One embodiment consistent with the present disclosure includes a multi-level thick film circuit formed on a substrate and having a first layer disposed on the substrate. The first layer may include a first conductive component formed using a first conductive element. The first conductive element may be a precious metal. The circuit may further include a second layer having a second conductive component. The second conductive component may be formed using a second conductive element. In one embodiment, the second conductive element may be a base metal. At least a portion of the first conductive element may directly contact at least a portion of the second conductive element such that the first layer is in electrical communication with the second layer.