Invention Grant
- Patent Title: Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board
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Application No.: US15130943Application Date: 2016-04-16
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Publication No.: US09681541B2Publication Date: 2017-06-13
- Inventor: Toshiyuki Higashida , Hidetsugu Motobe , Daisuke Nii
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2014-215672 20141022
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03 ; C08J5/24 ; C08G59/40 ; C08K5/09 ; C08L25/08 ; C08L63/00 ; C08G59/42 ; C08L63/08 ; B32B5/02 ; B32B15/082 ; B32B15/14 ; B32B15/20 ; B32B27/18 ; B32B27/20 ; B32B27/30 ; B32B15/092

Abstract:
Resin composition of the present disclosure includes: an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group in a molecule. An acid value of the SMA is in a range from 300 to 550, inclusive. A ratio of an anhydride equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive. A ratio of the total number of the equivalent numbers of the anhydride groups of the anhydride and the SMA with respect to the epoxy group equivalent number is a range from 0.5 to 1.2, inclusive.
Public/Granted literature
- US20160234934A1 RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD Public/Granted day:2016-08-11
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