Invention Grant
- Patent Title: Packaging method, packaging structure and display device
-
Application No.: US14785643Application Date: 2015-04-28
-
Publication No.: US09680134B2Publication Date: 2017-06-13
- Inventor: Jiuxia Yang , Feng Bai , Ruiyong Wang
- Applicant: BOE Technology Group Co., Ltd. , Beijing BOE Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BOE Technology Group Co., Ltd.,Beijing BOE Optoelectronics Technology Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.,Beijing BOE Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Westman, Champlin & Koehler, P.A.
- Priority: CN201410645978 20141112
- International Application: PCT/CN2015/077671 WO 20150428
- International Announcement: WO2016/074445 WO 20160519
- Main IPC: H01L51/52
- IPC: H01L51/52 ; B32B37/14 ; C03B23/203 ; H01L33/48 ; H01L51/56 ; H01L51/00

Abstract:
The present disclosure provides a packaging method, a packaging structure and a display device. The packaging method comprises forming a pattern of a packaging adhesive on a packaging area of a first substrate, and forming a heat dissipating structure on the packaging area of any of the first substrate and a second substrate; attaching the first substrate and the second substrate, and aligning the packaging area of the first substrate with that of the second substrate; illuminating the pattern of the packaging adhesive by a laser beam to melt and frit it, so as to form a packaging adhesive structure between the first and second substrates. In the present invention, in the case that the heat dissipating structure is manufactured on the packaging area, when the packaging adhesive is illuminated by the laser beam to be melted, the heat dissipating structure can quickly dissipate the heat, effectively suppress the rapid increase of the substrate temperature caused by the laser illumination, and reduce the damage to the drive back plate.
Public/Granted literature
- US20160351844A1 PACKAGING METHOD, PACKAGING STRUCTURE AND DISPLAY DEVICE Public/Granted day:2016-12-01
Information query
IPC分类: