Invention Grant
- Patent Title: Composite substrate, piezoelectric device, and method for manufacturing composite substrate
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Application No.: US14565902Application Date: 2014-12-10
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Publication No.: US09680083B2Publication Date: 2017-06-13
- Inventor: Yuji Hori , Tomoyoshi Tai , Akira Hamajima , Toshinao Nakahara
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Aichi
- Assignee: NGK INSULATORS, LTD.
- Current Assignee: NGK INSULATORS, LTD.
- Current Assignee Address: JP Aichi
- Agency: Cermak Nakajima & McGowan LLP
- Agent Tomoko Nakajima
- Main IPC: H01L41/09
- IPC: H01L41/09 ; H03H9/25 ; H01L41/08 ; H03H9/02 ; H01L41/22 ; H03H3/08

Abstract:
A composite substrate 10 includes a piezoelectric substrate 12 and a support layer 14 bonded to the piezoelectric substrate 12. The support layer 14 is made of a material having no crystalline anisotropy in a bonded surface thereof and has a smaller thickness than the piezoelectric substrate 12. The piezoelectric substrate 12 and the support layer 14 are bonded together with an adhesive layer 16 therebetween. The composite substrate 10 has a total thickness of 180 μm or less. The base thickness ratio Tr=t2/(t1+t2) is 0.1 to 0.4, where t1 is the thickness of the piezoelectric substrate 12, and t2 is the thickness of the support layer 14. The thickness t1 is 100 μm or less. The thickness t2 is 50 μm or less.
Public/Granted literature
- US20150091416A1 Composite Substrate, Piezoelectric Device, and Method for Manufacturing Composite Substrate Public/Granted day:2015-04-02
Information query
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