ESD device for a semiconductor structure
Abstract:
An electrostatic discharge (ESD) device for an integrated circuit includes a substrate having a longitudinally extending fin dispose thereon. A first n-type FinFET (NFET) is disposed within the fin. The NFET includes an n-type source, an n-type drain and a p-well disposed within the substrate under the source and drain. A p-type FinFET (PFET) is disposed within the fin. The PFET includes a p-type source/drain region and an n-well disposed within the substrate under the source/drain region. The n-well and p-well are located proximate enough to each other to form an np junction therebetween. The p-type source/drain region of the PFET and the n-type drain of the NFET are electrically connected to a common input node.
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