Invention Grant
- Patent Title: Graphene wiring structure and manufacturing method thereof
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Application No.: US15055894Application Date: 2016-02-29
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Publication No.: US09679851B2Publication Date: 2017-06-13
- Inventor: Tadashi Sakai , Hisao Miyazaki , Masayuki Katagiri , Yuichi Yamazaki
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-059052 20150323
- Main IPC: H01L23/532
- IPC: H01L23/532 ; H01L23/528 ; H01L21/02 ; H01L21/768
Abstract:
A graphene wring structure of an embodiment includes multilayer graphene, a first interlayer compound existing in an interlayer space of the multilayer graphene, and a second interlayer compound existing in the interlayer space of the multilayer graphene. The second interlayer compound containing at least one of an oxide, a nitride and a carbide.
Public/Granted literature
- US20160284646A1 GRAPHENE WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-09-29
Information query
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