Invention Grant
- Patent Title: Tape chip on lead using paste die attach material
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Application No.: US14970872Application Date: 2015-12-16
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Publication No.: US09679831B2Publication Date: 2017-06-13
- Inventor: Lai Nguk Chin , Paphat Phaoharuhan , Sally Foong
- Applicant: Cypress Semiconductor Corporation
- Applicant Address: US CA San Jose
- Assignee: Cypress Semiconductor Corporation
- Current Assignee: Cypress Semiconductor Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L21/48 ; H01L21/56
Abstract:
According to various embodiments, systems and methods for packaging a semiconductor device are provided. The disclosure discusses a semiconductor die having a top side and a bottom side that is disposed on a lead frame. An adhesive paste is then applied to attach the semiconductor die to the lead frame such that the adhesive paste fixes the die to a portion of the lead frame. The adhesive paste may be applied directly between die and the lead frame or may be applied in conjunction with a frame tape.
Public/Granted literature
- US20170047272A1 TAPE CHIP ON LEAD USING PASTE DIE ATTACH MATERIAL Public/Granted day:2017-02-16
Information query
IPC分类:
