A wireless process communication adapter for field devices is provided. The adapter includes a metal housing having a first end and a second end. A chamber is defined between the first and second ends. A radio-frequency transparent radome is coupled to the first end. The second end has a field device coupling configured to attach to a field device. At least one circuit board is disposed within the chamber. The circuit board supports at least wireless process communication circuitry. A plurality of wires is coupled to the at least one circuit board and extends through the field device coupling. A silicone potting fills substantially all volume within the chamber not occupied by the at least one circuit board and wireless process communication circuitry.