Invention Grant
- Patent Title: Superconducting accelerating cavity and electropolishing method for superconducting accelerating cavity
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Application No.: US14494867Application Date: 2014-09-24
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Publication No.: US09674936B2Publication Date: 2017-06-06
- Inventor: Hiroshi Hara
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Hyogo
- Assignee: MITSUBISHI HEAVY INDUSTRIES MECHATRONICS SYSTEMS, LTD
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES MECHATRONICS SYSTEMS, LTD
- Current Assignee Address: JP Hyogo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2013-252262 20131205
- Main IPC: H05H7/20
- IPC: H05H7/20 ; C25F3/26

Abstract:
Provided is a superconducting accelerating cavity 30 including: a cavity main body 10 formed of a superconducting material into a cylindrical shape; and a refrigerant tank 20 installed around the cavity main body 10 and storing a refrigerant which is supplied from the outside through a supply port 20a into a space formed between the refrigerant tank and the outer circumferential surface of the cavity main body 10, wherein the outer circumferential surface of the cavity main body 10 is coated with a metal coating layer 10a having a higher conductivity than the superconducting material.
Public/Granted literature
- US20150163894A1 SUPERCONDUCTING ACCELERATING CAVITY AND ELECTROPOLISHING METHOD FOR SUPERCONDUCTING ACCELERATING CAVITY Public/Granted day:2015-06-11
Information query
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