Invention Grant
- Patent Title: Semiconductor device having modified profile metal gate
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Application No.: US14952733Application Date: 2015-11-25
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Publication No.: US09673292B2Publication Date: 2017-06-06
- Inventor: Yu-Lien Huang , Chi-Wen Liu , Clement Hsingjen Wann , Ming-Huan Tsai , Zhao-Cheng Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/66 ; H01L21/02 ; H01L29/423 ; H01L29/51 ; H01L29/78

Abstract:
A semiconductor device having a semiconductor substrate with a dielectric layer disposed thereon. A trench is defined in the dielectric layer. A metal gate structure is disposed in the trench. The metal gate structure includes a first layer and a second layer disposed on the first layer. The first layer extends to a first height in the trench and the second layer extends to a second height in the trench; the second height is greater than the first height. In some embodiments, the second layer is a work function metal and the first layer is a dielectric. In some embodiments, the second layer is a barrier layer.
Public/Granted literature
- US20160079383A1 SEMICONDUCTOR DEVICE HAVING MODIFIED PROFILE METAL GATE Public/Granted day:2016-03-17
Information query
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