Invention Grant
- Patent Title: ESD device compatible with bulk bias capability
-
Application No.: US14873859Application Date: 2015-10-02
-
Publication No.: US09673190B2Publication Date: 2017-06-06
- Inventor: Kangguo Cheng , Bruce B. Doris , Terence B. Hook , Ali Khakifirooz , Pranita Kerber , Balasubramanian Pranatharthiharan , Ghavam G. Shahidi
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/06

Abstract:
A device having an electrostatic discharge structure includes a bulk substrate having a first dopant conductivity, first wells formed adjacent to a surface of the bulk substrate, including a second dopant conductivity, and second wells formed adjacent to the surface of the bulk substrate within the first wells, including the first dopant conductivity. A supply bus is formed in one of the first wells outside the second well. A ground bus has a first portion formed in another first well outside the second well, and a second portion is formed inside the second well such that a charge input to the second wells is dissipated without accumulating in the bulk substrate.
Public/Granted literature
- US20170098646A1 ESD DEVICE COMPATIBLE WITH BULK BIAS CAPABILITY Public/Granted day:2017-04-06
Information query
IPC分类: