Invention Grant
- Patent Title: Silicon-based substrate having first and second portions
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Application No.: US14892373Application Date: 2014-05-02
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Publication No.: US09673052B2Publication Date: 2017-06-06
- Inventor: Hiroshi Shikauchi , Ken Sato , Hirokazu Goto , Masaru Shinomiya , Keitaro Tsuchiya , Kazunori Hagimoto
- Applicant: SANKEN ELECTRIC CO., LTD. , SHIN-ETSU HANDOTAI CO., LTD.
- Applicant Address: JP Saitama JP Tokyo
- Assignee: SANKEN ELECTRIC CO., LTD.,SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee: SANKEN ELECTRIC CO., LTD.,SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee Address: JP Saitama JP Tokyo
- Agency: Oliff PLC
- Priority: JP2013-116208 20130531
- International Application: PCT/JP2014/002405 WO 20140502
- International Announcement: WO2014/192228 WO 20141204
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L29/66 ; H01L21/225 ; H01L21/02 ; H01L29/778 ; C30B23/02 ; C30B25/18 ; C30B29/40 ; C30B29/06

Abstract:
A silicon-based substrate on which a nitride compound semiconductor layer is formed on a front surface thereof, including a first portion provided on the front surface side which has a first impurity concentration and a second portion provided on an inner side of the first portion which has a second impurity concentration higher than the first impurity concentration, wherein the first impurity concentration being 1×1014 atoms/atomscm3 or more and less than 1×1019 atoms/cm3. Consequently, there is provided the silicon-based substrate in which the crystallinity of the nitride compound semiconductor layer formed on an upper side thereof can be maintained excellently while improving a warpage of the substrate.
Public/Granted literature
- US20160126099A1 SILICON-BASED SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2016-05-05
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