A support plate is used for supporting an electronic device. The support plate includes a first plate member, a foldable portion, and a second plate member. The foldable portion is connected to the first plate member and the second plate member. The first plate member includes a combining portion far away from the foldable portion and a contact portion adjacent to the foldable portion. The second plate member includes at least one combined portion and a non-slip element attached on a side surface of the second plate member. The combining portion is foldable to combinedly position the combined portion, wherein the contact portion supports the second plate member and forms an included angle with the second plate member. Accordingly, the support plate can stably support the electronic device and can be expanded or received quickly.