Invention Grant
- Patent Title: Semiconductor component with chip for the high-frequency range
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Application No.: US14576442Application Date: 2014-12-19
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Publication No.: US09669480B2Publication Date: 2017-06-06
- Inventor: Daniel Hageneder , Martin Kappels
- Applicant: Rohde & Schwarz GmbH & Co. KG
- Applicant Address: DE Munich
- Assignee: Rohde & Schwarz GmbH & Co. KG
- Current Assignee: Rohde & Schwarz GmbH & Co. KG
- Current Assignee Address: DE Munich
- Agency: Lee & Hayes, PLLC
- Priority: DE102013226989 20131220
- Main IPC: H05K1/00
- IPC: H05K1/00 ; B23K1/00 ; H01L23/00 ; B23K1/008 ; H01L23/043 ; H05K1/02 ; H05K1/14 ; B23K101/42 ; H05K1/11
Abstract:
The invention relates to a semiconductor component with a chip, especially with a high-frequency switching circuit. The semiconductor component further comprises a metal body on the chip and a supplementary circuit board. The supplementary circuit board is provided on an underside facing away from the metal body for connection with a printed-circuit board by means of reflow soldering.
Public/Granted literature
- US20150181712A1 Semiconductor component with chip for the high-frequency range Public/Granted day:2015-06-25
Information query
