A method of manufacturing a package structure includes at least the following steps. A wafer is provided. A flux layer is applied onto at least part of the wafer. A stencil is provided over the wafer. The stencil includes a plurality of apertures exposing the flux layer. A dispenser is provided over the stencil. A plurality of SMDs are fed over the stencil with the dispenser. The dispenser is moved to drive the SMDs into the apertures of the stencil. The stencil is removed and the flux layer is reflowed.