Invention Grant
- Patent Title: High electron mobility transistors exhibiting dual depletion and methods of manufacturing the same
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Application No.: US12929492Application Date: 2011-01-28
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Publication No.: US09660048B2Publication Date: 2017-05-23
- Inventor: In-jun Hwang , Jong-seob Kim , Hyuk-soon Choi , Ki-ha Hong , Jai-kwang Shin , Jae-joon Oh
- Applicant: In-jun Hwang , Jong-seob Kim , Hyuk-soon Choi , Ki-ha Hong , Jai-kwang Shin , Jae-joon Oh
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2010-0018631 20100302
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/778 ; H01L29/06 ; H01L29/20 ; H01L29/417 ; H01L29/423

Abstract:
High electron mobility transistors (HEMT) exhibiting dual depletion and methods of manufacturing the same. The HEMT includes a source electrode, a gate electrode and a drain electrode disposed on a plurality of semiconductor layers having different polarities. A dual depletion region exists between the source electrode and the drain electrode. The plurality of semiconductor layers includes an upper material layer, an intermediate material layer and a lower material layer, and a polarity of the intermediate material layer is different from polarities of the upper material layer and the lower material layer.
Public/Granted literature
- US20110215378A1 High electron mobility transistors exhibiting dual depletion and methods of manufacturing the same Public/Granted day:2011-09-08
Information query
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