The present invention is a multilayer wiring board and a method for manufacturing the same, the multilayer wiring board having a hole for interlayer connection penetrating a metal foil and an insulating layer; an overhang of the metal foil formed at an opening of the hole; lower space formed between the overhang and an inside wall of the hole; and interlayer connection in which the hole is filled with electrolytic filling plating layers, wherein the electrolytic filling plating layers are formed as at least two or more layers, the lower space is filled with any electrolytic filling plating layer except for an outermost layer of the two or more layers of electrolytic filling plating layers, and a diameter in the inside of the interlayer connection formed by any electrolytic filling plating layer except for an outermost layer is equal to or larger than a diameter of the opening.