Invention Grant
- Patent Title: Companion integrated circuit having decoupling capacitor and mobile device having the same
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Application No.: US14704376Application Date: 2015-05-05
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Publication No.: US09648747B2Publication Date: 2017-05-09
- Inventor: Jeong-Sik Yu
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2014-0061783 20140522
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; G06F1/16 ; H01L23/64 ; H05K1/11 ; H05K1/02 ; H01L23/00
Abstract:
A companion integrated circuit (IC) and a mobile device having the same are provided. The companion IC may include a decoupling capacitor that stably supplies voltage to an application processor, at least one auxiliary semiconductor device that communicates with the application processor, and a multi-chip package that includes the decoupling capacitor and the auxiliary semiconductor device.
Public/Granted literature
- US20150342051A1 COMPANION INTEGRATED CIRCUIT HAVING DECOUPLING CAPACITOR AND MOBILE DEVICE HAVING THE SAME Public/Granted day:2015-11-26
Information query
