Invention Grant
- Patent Title: Systems and methods for mounting the printed wiring assembly to the header assembly of a pressure sensor
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Application No.: US14521287Application Date: 2014-10-22
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Publication No.: US09648745B2Publication Date: 2017-05-09
- Inventor: Gregory C. Brown , Thomas J. Rolfer , Peter J. Dukich
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Fogg & Powers LLC
- Main IPC: G01L9/00
- IPC: G01L9/00 ; H05K1/18 ; G01L19/14 ; H05K3/30

Abstract:
Systems and method for mounting the printed wiring assembly to the header assembly of a pressure sensor are provided. In at least one embodiment, the pressure sensor comprises: a header assembly; a printed wiring assembly having a pressure sensor mounted thereon; and, at least one substantially cylindrical member that mechanically couples the printed wiring assembly to the header assembly. The substantially cylindrical member has a substantially hollow core, a substantially circular first end attached to the header assembly, a substantially circular second end opposite the substantially circular first end, and at least one side extending from the substantially circular first end to the substantially circular second end of the cylindrical member. Furthermore, the substantially circular second end or the at least one side or both are attached to the printed wiring assembly.
Public/Granted literature
- US20160120035A1 SYSTEMS AND METHODS FOR MOUNTING THE PRINTED WIRING ASSEMBLY TO THE HEADER ASSEMBLY OF A PRESSURE SENSOR Public/Granted day:2016-04-28
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