Invention Grant
- Patent Title: Ejectable component assemblies in electronic devices
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Application No.: US13610701Application Date: 2012-09-11
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Publication No.: US09648744B2Publication Date: 2017-05-09
- Inventor: Michael B. Wittenberg , Miguel C. Christophy , Shayan Malek
- Applicant: Michael B. Wittenberg , Miguel C. Christophy , Shayan Malek
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H05K1/18
- IPC: H05K1/18 ; G06F1/16 ; H05K7/02 ; H05K3/00 ; H05K3/30 ; G06K13/08 ; H05K1/11

Abstract:
Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.
Public/Granted literature
- US20140029206A1 EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES Public/Granted day:2014-01-30
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