- Patent Title: Wafers, panels, semiconductor devices, and glass treatment methods
-
Application No.: US14679557Application Date: 2015-04-06
-
Publication No.: US09648734B2Publication Date: 2017-05-09
- Inventor: Wen-Shiang Liao
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H05K1/03 ; H01L21/02 ; C03C17/00 ; G02F1/00 ; H01L21/48 ; H01L23/498 ; H05K1/11 ; H01L27/15 ; G02F1/1333
Abstract:
Glass treatment methods, wafer, panels, and semiconductor devices are disclosed. In some embodiments, a method of forming a wafer or panel includes forming an opening through a glass substrate, forming a composite film on the glass substrate and on sidewalls of the opening, and filling the opening.
Public/Granted literature
- US20150216047A1 Wafers, Panels, Semiconductor Devices, and Glass Treatment Methods Public/Granted day:2015-07-30
Information query
IPC分类:
