Invention Grant
- Patent Title: Coreless organic substrate
-
Application No.: US14601973Application Date: 2015-01-21
-
Publication No.: US09648728B1Publication Date: 2017-05-09
- Inventor: Vincent Hool , Susan Huang
- Applicant: ALTERA CORPORATION
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L25/065 ; H05K1/02 ; H01L23/00 ; H01L23/14 ; H05K1/03 ; H05K1/11
Abstract:
A coreless organic substrate in which a mounting hole is formed near each corner of the substrate and is used during assembly processes to secure the substrate so as to prevent flexing.
Information query
IPC分类:
