Invention Grant
- Patent Title: PCB embedded power module
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Application No.: US14597695Application Date: 2015-01-15
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Publication No.: US09648722B2Publication Date: 2017-05-09
- Inventor: Thomas E. Gerhäuβer
- Applicant: HS Elektronik Systeme GmbH
- Applicant Address: DE Nordlingen
- Assignee: Elektronik Systeme GmbH
- Current Assignee: Elektronik Systeme GmbH
- Current Assignee Address: DE Nordlingen
- Agency: Snell & Wilmer L.L.P.
- Priority: DE102014101238 20140131
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/02 ; H05K1/03 ; H05K1/18 ; H05K3/30 ; H01L23/538 ; H01L23/498 ; H01L21/48 ; H05K3/46
Abstract:
A printed circuit board assembly comprises a printed circuit board having at least one conductive layer supported by a substrate layer, and at least one power semiconductor device, wherein the at least one power semiconductor device is at least partly embedded in the substrate layer.
Public/Granted literature
- US20150223320A1 PCB EMBEDDED POWER MODULE Public/Granted day:2015-08-06
Information query
