The present disclosure discloses a MEMS microphone including a MEMS chip, an ASIC chip and an injection molding package. The MEMS chip is stacked on and connected to the ASIC chip by a TSV connector. The MEMS chip comprises a substrate having a cavity, a back plate and a diaphragm for forming a capacitor structure. The cavity is divided by the capacitor structure into a rear acoustic cavity facing the ASIC chip and the front acoustic cavity opposite to the rear acoustic cavity. The size of the MEMS microphone is reduced effectively, as the MEMS chip is stacked on the ASIC chip and connected each other by a TSV connector.