- Patent Title: Apparatus for flexible electronic interfaces and associated methods
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Application No.: US13350662Application Date: 2012-01-13
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Publication No.: US09647668B2Publication Date: 2017-05-09
- Inventor: Tony Ngai
- Applicant: Tony Ngai
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L27/10
- IPC: H01L27/10 ; H03K19/177 ; H01L25/065
Abstract:
A semiconductor die includes at least one flexible interface block. The flexible interface block includes at least one interconnect, and at least one buffer coupled to the at least one interconnect. The flexible interface block further includes a routing interface coupled to circuitry integrated in the semiconductor die, and a controller coupled to provide communication between the routing interface and the at least one buffer.
Public/Granted literature
- US20130181257A1 APPARATUS FOR FLEXIBLE ELECTRONIC INTERFACES AND ASSOCIATED METHODS Public/Granted day:2013-07-18
Information query
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