In an elastic wave filter device, a package substrate is provided with an elastic wave filter chip defining a ladder circuit including a plurality of series arm resonators and a plurality of parallel arm resonators, and a first inductance connected in parallel with at least one of the series arm resonators and a second inductance connected between at least one of the parallel arm resonators and a ground potential. The first inductance and the second inductance provided in the package substrate, and the first inductance is magnetically coupled to the second inductance to shift a frequency position of an attenuation pole.