A charge pump includes chip, package substrate and circuit board. Chip includes transistor set including at least four transistors connected to first input end of input terminal set and two rows of odd number and even number second input ends of input terminal set. Except first transistor, the other transistors are arranged in two rows subject to odd number and even number and respectively electrically coupled to the two rows of at least three second input ends by traces. At least three second external pins of package substrate and at least three capacitors of circuit board are respectively arranged in two rows subject to odd number and even number, enabling first circuit with connected odd number second external pins and second circuit with connected even number second external pin to be kept apart without intersection. Traces in chip are arranged in staggered manner, reducing parasitic capacitance.