Invention Grant
- Patent Title: Semiconductor laser module and method of manufacturing the same
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Application No.: US14843408Application Date: 2015-09-02
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Publication No.: US09647421B2Publication Date: 2017-05-09
- Inventor: Naoki Kimura , Susumu Nakaya
- Applicant: FUJIKURA LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJIKURA LTD.
- Current Assignee: FUJIKURA LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2013-043015 20130305
- Main IPC: H01S5/022
- IPC: H01S5/022 ; G02B27/09 ; H01S5/00

Abstract:
The semiconductor laser module 1 has a first substrate 10, a second substrate 20 provided on the first substrate 10, a semiconductor laser device 30 operable to emit a laser beam L having an optical axis along the Z-direction, a collimator lens 40 configured to collimate components of the laser beam L along a direction of a fast axis (Y-direction), and a lens fixture block 50 having a lens attachment surface 50A and a block fixation surface 50B that are perpendicular to the X-direction. An end 40A of the collimator lens 40 along the X-direction is fixed to the lens attachment surface 50A of the lens fixture block 50 with a lens fixation resin 42. The block fixation surface 50B of the lens fixture block 50 is fixed to a side surface 20A of the second substrate 20 along the X-direction with a block fixation resin 52.
Public/Granted literature
- US20150380896A1 SEMICONDUCTOR LASER MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-12-31
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