Invention Grant
- Patent Title: Structural body and wireless communication apparatus
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Application No.: US14433759Application Date: 2014-01-16
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Publication No.: US09647322B2Publication Date: 2017-05-09
- Inventor: Akihiro Iriyama
- Applicant: SHARP KABUSHIKI KAISHA
- Applicant Address: JP Osaka
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2013-059151 20130321
- International Application: PCT/JP2014/050677 WO 20140116
- International Announcement: WO2014/148075 WO 20140925
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H05K1/02 ; H05K1/16
Abstract:
A first resin layer is provided with a step part formed in conformity with a shape of at least part of an electrically conductive pattern, and the first resin layer and a second resin layer closely adhere to each other in the step part.
Public/Granted literature
- US20150249284A1 STRUCTURAL BODY AND WIRELESS COMMUNICATION APPARATUS Public/Granted day:2015-09-03
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