Invention Grant
- Patent Title: Wave dielectric transmission device, manufacturing method thereof, and in-millimeter wave dielectric transmission method
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Application No.: US15097538Application Date: 2016-04-13
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Publication No.: US09647311B2Publication Date: 2017-05-09
- Inventor: Hirofumi Kawamura , Yasuhiro Okada
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2008-246511 20080925
- Main IPC: H01P3/16
- IPC: H01P3/16 ; G01S7/03 ; H01Q9/04 ; H04B10/00 ; H04B10/50 ; H04B10/516 ; H04B10/556 ; H01P5/02 ; H04B1/3822 ; G01S13/93

Abstract:
A millimeter wave transmission device, the millimeter wave transmission device having (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.
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