Invention Grant
- Patent Title: Resistive random access memory (RRAM) structure
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Application No.: US14605023Application Date: 2015-01-26
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Publication No.: US09647207B2Publication Date: 2017-05-09
- Inventor: Hai-Dang Trinh , Chia-Shiung Tsai , Chin-Wei Liang , Cheng-Yuan Tsai , Hsing-Lien Lin , Chin-Chieh Yang , Wen-Ting Chu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
A resistive random access memory (RRAM) cell with a high κ layer based on a group-V oxide and hafnium oxide is provided. The RRAM cell includes a bottom electrode layer, a group-V oxide layer arranged over the bottom electrode layer, and a hafnium oxide based layer arranged over and abutting the group-V oxide layer. The RRAM cell further includes a capping layer arranged over and abutting the hafnium oxide based layer, and a top electrode layer arranged over the capping layer. A method for manufacturing the RRAM cell is also provided.
Public/Granted literature
- US20160218283A1 RESISTIVE RANDOM ACCESS MEMORY (RRAM) STRUCTURE Public/Granted day:2016-07-28
Information query
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